Semikron application notes provide detailed technical guidance for implementing power semiconductor solutions across various applications. These documents, created by our technical experts, cover design guidelines, practical implementation examples, and best practices for circuit design, thermal management, and system optimization. Our application notes combine theoretical principles with practical experience from real-world implementations.
Technical insights from factory application engineers
Real-world design examples and implementation guidelines
Circuit design, thermal management, and system integration
Organized technical resources by topic
Gate drive, snubber circuits, and protection implementation
Cooling solutions, thermal interface materials, and heat dissipation
Understanding IGBT, MOSFET, and thyristor parameters
Complete system design and component interaction
Guidance for proper circuit implementation
Comprehensive guide to IGBT and MOSFET gate drive design, including drive strength, isolation, and protection features.
Design and selection of RC snubber circuits for voltage suppression in switching applications.
Implementation of desaturation detection, overcurrent protection, and under-voltage lockout.
Guidelines for paralleling IGBTs and thyristors for high-current applications.
Guidance for effective thermal design
Fundamental principles for thermal management of power semiconductors including thermal resistance calculations.
Selection and application of thermal greases, pads, and phase-change materials.
Selection of heatsinks for various cooling methods: natural convection, forced air, and liquid cooling.
Understanding thermal cycling effects and improving long-term reliability.
Understanding power semiconductor parameters
Comparison of different IGBT technologies: IGBT3, IGBT4, and TRENCHSTOP.
Understanding and applying SOA curves for different power devices.
Understanding turn-on and turn-off behaviors and their impact on design.
Understanding thermal parameters and their impact on reliability.
Complete system design guidance
Techniques for electromagnetic compatibility in power electronics systems.
Complete guide to implementing variable frequency drives with Semikron components.
Complete design guide for photovoltaic inverter systems.
Design guidelines for various UPS topologies and safety requirements.
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FAE Technical Commentary
Expert insights on application note topics
For gate drive design, one of the most common design challenges is achieving the right balance between switching speed and electromagnetic compatibility. Faster switching reduces losses but increases EMI. The gate resistor value significantly affects switching behavior and must be optimized for each application.
When implementing protection circuits, desaturation detection is critical for IGBT safety. However, the desat detection time constant must be properly matched to the IGBT's short-circuit capability, which varies with technology generation and operating conditions.
For thermal design, always consider the thermal interface materials' thermal resistance, which can significantly impact the total thermal path. At high power densities, this can represent 20-30% of the total thermal resistance from junction to ambient.