Semikron IPM (Intelligent Power Modules) combine IGBTs or MOSFETs with integrated driver circuits, bootstrap diodes, and protection functions in a single package. Our SKiiP and MiniSKiiP systems offer exceptional integration and reliability, particularly suitable for applications requiring compact design and high performance. These modules significantly reduce external component count while providing comprehensive protection features including overcurrent, short-circuit, and under-voltage lockout protection. With our in-depth technical expertise and extensive inventory, we provide complete IPM solutions from selection to implementation. Our factory-trained FAEs ensure optimal utilization of these sophisticated power modules across diverse applications from motor drives to renewable energy systems.
Driver circuits, protection and power devices in one package
Comprehensive overcurrent, short-circuit, and under-voltage protection
Reduced system footprint with integrated functionality
Explore different Semikron IPM technologies
Technical specifications for popular Semikron IPM modules
| Model | Vces (V) | Ic (A) | Package | Topology | Series | Actions |
|---|---|---|---|---|---|---|
| MiniSKiiP 3 1200V/600A | 1200 | 600 | MiniSKiiP | Phase Leg | MiniSKiiP | Datasheet Inquiry |
| SKiiP 3 1200V/400A | 1200 | 400 | SKiiP | Phase Leg | SKiiP 3 | Datasheet Inquiry |
| SKiiP 3 1700V/300A | 1700 | 300 | SKiiP | Phase Leg | SKiiP 3 | Datasheet Inquiry |
| MiniSKiiP 4 1200V/300A | 1200 | 300 | MiniSKiiP | Phase Leg | MiniSKiiP 4 | Datasheet Inquiry |
| SKiiP 4 1200V/600A | 1200 | 600 | SKiiP | Phase Leg | SKiiP 4 | Datasheet Inquiry |
Industry solutions powered by Semikron IPM modules
Download documentation and design tools
Our FAE team can help you choose the right Semikron IPM for your application
Contact Technical Experts
FAE Technical Commentary
Expert insights on IPM module selection
For compact designs, MiniSKiiP's copper-less spring-contact technology provides the best cost optimization while maintaining excellent thermal performance. The press-fit connection technology eliminates the need for copper base plates, reducing both weight and thermal resistance compared to traditional soldered connections.
When designing for high-vibration environments like wind turbines or industrial machinery, SKiiP systems with their press-fit technology provide superior mechanical reliability compared to traditional soldered connections. The spring-loaded contacts maintain connection integrity even under severe vibration conditions.
For high-efficiency applications, select IPMs with low saturation voltage and optimized gate drive circuits. The built-in under-voltage lockout (UVLO) protection prevents device damage during low gate drive conditions, but ensure your control circuit maintains adequate gate supply voltage during operation.